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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. 28.aug.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com white backlight led driver for medium to large lcd panels (switching regulator type) BD8119FM-M general description BD8119FM-M is a white led driver with the capability to withstand high input voltage (36v m ax ). this driver has 4ch constant-current drivers integrated in 1-chip. each channel can draw up to 150ma max for driving high brightness on led. a current-mode buck-boost dc/dc controller is also integrated to achieve stable operation against unstable car-battery voltage input. this also removes the constraint of the number of leds in series connection. the brightness can be controlled by either pwm or vdac techniques. features integrated buck-boost current-mode dc/dc controller four integrated led current driver channels (150ma max each channel) pwm light modulation (minimum pulse width 25s) built-in protection functions (uvlo, ovp, tsd, ocp, scp) abnormal status detection function (open/ short) applications backlight for car navigation, dashboard panels, etc. key specifications ? input supply voltage range: 5.0v to 30v ? standby current: 4a (typ) ? led maximum output current: 150ma(max) ? operating temperature range: - 40 c to + 95 c package w(typ) x d(typ) x h(max) hsop-m28 18.50mm x 9.90mm x 2.41mm datashee t downloaded from: http:///
BD8119FM-M 2/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 pin configuration pin descriptions pin symbol function pin symbol function 1 comp err or a mp lifier output 15 led3 led output 3 2 ss soft start time-setting capacitance input 16 led4 led output 4 3 vcc input power supply 17 ovp over-voltage detection input 4 en enable input 18 vdac dc variable light modulat ion input 5 rt oscillation frequency-setting resistance input 19 iset led output current-setting resistance input 6 sync external synchronization signal input 20 pgnd led output gnd 7 gnd small-signal gnd 21 - n o connection 8 pwm pwm light modulation input 22 outl low -side external mosfet gate drive output 9 fail1 failure signal output 23 dgnd low -side internal mosfet source output 10 fail2 led open/short detecti on signal output 24 sw high-side external mosfet source pin 11 leden1 led output enable pin 1 25 outh high-side external mosfet gate drive outpin 12 leden2 led output enable pin 2 26 cs dc/dc current sense pin 13 led1 led output 1 27 boot high-side mosfet power supply pin 14 led2 led output 2 28 vreg internal reference voltage output comp 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 ss vcc en rt sync gnd pwm fail1 fail2 leden1 leden2 led2 led1 vreg boot cs outh sw dgnd outl n.c. pgnd iset vdac ovp led3 led4 (top view) downloaded from: http:///
BD8119FM-M 3/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 block diagram dgnd comp err amp vreg vcc en rt ovp osc control logic uvlo tsd ss pwm led 1 led 2 led 3 current driver iset pgnd pwm cs fail 1 vreg vdac gnd iset led 4 bootouth sw fail 2 leden1 leden2 sync vreg ovp timer latch pwm ocp drv ctl slope ocp ovp open short detect timer latch short det open det outl downloaded from: http:///
BD8119FM-M 4/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 absolute maximum ratings (ta=25 c ) parameter symbol rating unit power supply voltage v cc 36 v boot ,outh voltage v boot, v outh 41 v sw ,c s voltage v sw, v cs, v outh 36 v boot-sw voltage v boot- sw 7 v led output voltage v led1 , v led2 , v led3 , v led4 36 v vreg, ovp, outl, fail1, fail2, leden1, leden2, iset, vdac, pwm, ss, comp, rt, sync, en voltage v reg , v ovp, v outl, v fail1, v fail2, v leden1, v leden2, v iset, v vdac, v pwm, v ss, v comp, v rt, v sync, v en -0.3 to +7 < v cc v power consumption pd 2.20 (note 1) w operating temperature range topr - 40 to +95 c storage temperature range tstg - 55 to +150 c led maximum output current i led 150 (note 2) (note 3) ma (note 1 ) ic mounted on glass epoxy board measuring 70mm x 70mm x 1.6mm, power dissipated at a rate of 17.6mw/ c at temperatures above 25 c . (note 2 ) dispersion figures for led maximum output current and v f are correlated. please refer to data on separate sheet. (note 3 ) amount of current per channel. caution: use of the ic in excess of absolute maximum ratings (such as the input voltag e or operating temperature range) may result in damage t o the ic. assumptions should not be made regarding the state of the ic (e.g ., short mode or open mode) when such damage is suffered. if operational values are expected to exceed the maximum ratings for the device, consider adding pr otective circuitry (such as fuses) to eliminate the risk of damaging the ic. recommended operating condition s (ta=25 c ) parameter symbol rating u nit power supply voltage v cc 5.0 to 30 v oscillating frequency range f osc 250 to 550 kh z external synchronization frequency range (note 4) (note 5) f sync f osc to 550 khz e xt ernal synchronization pulse duty range f sduty 40 to 60 % (note 4) connect sync to gnd or open when not using external frequency s ynchronization. (note 5) do not switch between internal and external synchronization w hen an external synchronization signal is inputted to the device. downloaded from: http:///
BD8119FM-M 5/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 electrical characteristics (unless otherwise specified , v cc =12v ta=25 c ) parameter symbol limit unit conditions min typ max circuit current i cc - 7 14 ma en=hi, sync=hi, rt=open pwm=low, i set =open, c in =10f standby current i st - 4 8 a en=low [vreg block (vreg)] reference voltage v reg 4.5 5 5.5 v i reg =-5ma, c reg =2.2f [outh block] outh high-side on -resistance r onhh 1.0 3 4.5 i on =-10ma outh low-side on -resistance r onhl 0.5 2 3.0 i on =10ma over-current protection operating voltage v olimit v cc -0.66 v cc -0.6 v cc -0.54 v [outl block] outl high-side on -resistance r onlh 1.0 3 4.5 i on =-10ma outl low-side on -resistance r onll 0.5 2 3.0 i on =10ma [sw block] sw low -side on -resistance r on _ sw 1.0 2.0 4.0 i on_sw =10ma [error amplifier block] led voltage v led 0.9 1.0 1.1 v comp sink current i compsink 15 25 35 a v led =2v, v comp =1v comp source current i compsource - 35 - 25 - 15 a v led =0v, v comp =1v [oscillator block] oscillating frequency f osc 250 300 350 khz r rt =100k [ovp block] over-voltage detection reference voltage v ovp 1.9 2.0 2.1 v v ovp =sweep up ovp hysteresis width v ohys 0.45 0.55 0.65 v v ovp =sweep down scp latch off delay time t scp 70 100 130 ms r rt =100k [uvlo block ] uvlo voltage v uvlo 4.0 4.3 4.6 v v cc : sweep down uvlo hysteresis width v uhys 50 150 150 mv v cc : sweep up downloaded from: http:///
BD8119FM-M 6/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 electrical characteristics C continued (unless otherwise specified , v cc =12v ta=25 c ) parameter symbol limit u nit conditions min typ max [led output block] led current relative dispersion width i led1 -3 - +3 % i led =50ma, i led1 =(i led i led_avg - 1) x 100 led current absolute dispersion width i led2 -5 - +5 % i led =50ma, i led2 =(i led 50ma- 1) x 100 iset voltage v iset 1.96 2.0 2.04 v r iset 1=120k pwm minimum pulse width tmin 25 - - s f pwm =150hz, i led =50ma pwm maximum duty dmax - - 100 % f pwm =150hz, i led =50ma pwm frequency f pwm - - 20 khz duty=50%, i led =50ma vdac gain g vdac - 25 - ma/v v dac =0 v to 2v, r iset =120k i led =v dac r iset x gain o pen detection voltage v open 0.2 0.3 0.4 v v led = sweep down led short detection voltage v short 4.4 4.7 5.0 v v ovp = sweep up led short latch off delay time t short 70 100 130 ms r rt =100k pwm latch off delay time t pwm 70 100 130 ms r rt =100k [logic inputs (en, sync, pwm, leden1, leden2)] input high voltage v in h 2.1 - 5.5 v input low voltage v inl gnd - 0.8 v input current 1 i in 20 35 50 a v in =5v (sync, pwm, leden1, leden2) input current 2 i en 15 25 35 a v en =5v (en) [fail output (open drain) ] fail low voltage v ol - 0.1 0.2 v i ol =0.1ma downloaded from: http:///
BD8119FM-M 7/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 typical performance curves (unless otherwise specified, ta=25c) [khz] [v] 4.5 4.7 4.9 5.1 5.3 5.5 -40 -15 10 35 60 85 temperature:ta [ ] output voltage:vreg [v v cc =12v figure 1. output voltage vs temperature output voltage : v reg [v] temperature : ta [c] 200 240 280 320 360 400 -40 -15 10 35 60 85 temperature:ta [ ] switching frequency:fosc [khz] v cc =12v figure 2. switching frequency vs temperature switching frequency : f osc [khz] temperature : ta [c] 45 47 49 51 53 55 0.5 1.5 2.5 3.5 4.5 led voltage:vled[v] outputcurrent :iled [ma] v cc = 12v figure 3. output current vs led voltage (i led depend on v led ) output current : i led [ma] led voltage : v led [v] 45 47 49 51 53 55 -40 -15 10 35 60 85 temperature:ta [ ] outputcurrent :iled [ma] v cc = 12v figure 4. output current vs t em perature output current : i led [ma] temperature : ta [c] downloaded from: http:///
BD8119FM-M 8/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 typical performance curves C continued (unless otherwise specified, ta=25c) 0 10 20 30 40 50 0 0.5 1 1.5 2 vdac voltage:vdac[v] outputcurrent :iled [ma] figure 5. output current vs vdac voltage (vdac gain ) output current : i led [ma] vdac voltage : v dac [v] 0 1 2 3 4 5 0 0.02 0.04 0.06 0.08 0.1 vdac voltage:vdac[v] outputcurrent :iled [ma] figure 6. output current vs vdac voltage (vdac gain ) output current : i led [ma] vdac voltage : v dac [v] 25 40 55 70 85 100 25 150 275 400 525 output current [ma] efficiency [% ] v cc =5v v cc = 30 v v cc =12v figure 7. efficiency vs output current (depend on input voltage) efficiency [%] output current [ma] 25 40 55 70 85 100 25 150 275 400 525 output current [ma] efficiency [%] v cc =4v v cc = 15 v v cc = 30 v figure 8. efficiency vs output current (depend on output voltage) efficiency [%] output current [ma] downloaded from: http:///
BD8119FM-M 9/ 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 typical performance curves C continued (unless otherwise specified, ta=25c) 0 2 4 6 8 10 0 1 2 3 4 5 en voltage:ven [v] output voltage:vreg [v] figure 11. output voltage vs en threshold voltage output voltage : v reg [v] en voltage : v en [v] v cc = 12 v figure 10.output voltage vs temperature (over-current detecti on voltage temperature characteristic) output voltage : v cc - v cs [v] temperature : ta [c] 0.0 2.0 4.0 6.0 8.0 10.0 0 6 12 18 24 30 36 supply voltage:vcc [v] output carrent:icc [ma] v cc =12v figure 9. cicuit current vs supply voltage (switching off) circuit current : i cc [ma] supply voltage : v cc [v] 0 2 4 6 8 10 0 1 2 3 4 5 pwm voltage:ven [v] outputcurrent :iled [ma] figure 12. output current vs pwm threshold voltage output current : i led [ma] pwm voltage : v en [v] downloaded from: http:///
BD8119FM-M 10 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 application information 1. 5v voltage reference (vreg) 5v (typ) is generated from the vcc input voltage when the ena ble pin is set high. this voltage is used to power the internal circuitry as well as the voltage source for device pin s that need to be fixed to a logical high. uvlo protection is integrated into the vreg pin. the voltage regu lation circuitry operates uninterrupted for output voltages higher than 4.5v (typ) . i f output voltage drops to 4.3v (typ) or lower, uvlo operates and tur ns the ic off. connect a capacitor (c reg = 2.2 f typ) to the vreg terminal for phase compensation. operation may become unstable if c reg is not connected. 2. constant-current led drivers if less than four constant-current drivers are used, unuse d channels should be switched off based on leden pin configuration. the truth table for these pins is shown bel ow. i f a driver output is enabled but not used (i.e. left open), the ics open circuit -detection circuitry will operate. please keep the unused p ins open. the leden terminals are pulled down internally in the ic, so if left open, the ic will recogni ze them as logic lo. however, they should be connected directly to vreg or fixed to a logic hi when in use. led en led 1 2 1 2 3 4 l l on on on on h l on on on off l h on on off off h h on off off off (1) output current setting led current is computed based on the following equation: ? ? ? ? ? ? a gain r v v v i set iset dac led ? ? ? / 0.2 min , (mi n[ v dac , 2.0v] = the smaller value of either v dac or v iset ; gain = set by internal circuitry.) in applications where an external signal is used for outpu t current control, a control voltage in the range of 0.1v to 2.0v can be connected on the vdac pin to control according to the above equation. if an external control signal is not used, connect the vdac pin to vreg (do not leave the pin open as it may cause ic malfunction). also, do not switch individual channels on or off using leden pin while op erating in pwm mode. the following diagram illustrates the relation between i l ed and gain. in pwm intensity control mode, the on/off state of each current driver is controlled directly by the input signal on the pwm pin; thus, the duty ratio of the input signal on the pwm pin equals the duty ratio of the led current. when not controlling intensity at pwm, fix the pwm terminal to a high voltage (100%) . output light intensity is greatest at 100% input. pwm i led (50ma/div) pwm i led pwm=150hz duty=50% pwm=150hz duty=0.38% iled vs gain 2950 3000 3050 3100 3150 3200 3250 3300 3350 0 20 40 60 80 100 120 140 160 iled[ma] gain i led vs gain i led [ma] gain iled[ma] gain 10 3215 20 3080 30 3030 40 2995 50 3000 60 3020 70 3040 80 3070 90 3105 100 3140 110 3175 120 3210 130 3245 140 3280 150 3330 i led [ma] downloaded from: http:///
BD8119FM-M 11 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 3. buck-boost dc/dc controller (1) number of leds in series connection output voltage of the dcdc converter is controlled such that the forw ard voltage over each of the leds on the output is set to 1.0v (typ). dcdc operation is performed only when the led output is operating . when two or more led outputs are operating simultaneously, the led voltage outpu t is held at 1.0v (typ) per led from the set of leds in series with the highest v f value. the voltages of other led outputs are increased on ly in relation to the fluctuation of voltage over these leds in series. consideration should be giv en to the change in power dissipation due to variations in v f of the leds. please determine the allowable maximum v f variance of the total leds in series by using the description as shown below: v f variation allowable voltage 3.7v(typ ) = short detecting voltage 4.7v(typ ) - led control voltage 1.0v(typ) the number of leds that can be connected in series is limi ted due to the open-circuit protection circuit, which engages at 85% of the set ovp voltage. therefore, the maxim um output voltage of the under normal operation becomes ? ? ? ? ? ? series in leds of number maximum n /v 1.0v 30.6 where 0.85, 36v 30.6v f ? ? ? ? . (2) over-voltage protection circuit (ovp) the output of the dcdc converter should be connected to the ovp pin using a vol tage divider. in determining an appropriate trigger voltage for ovp function, consider the tot al number of leds in series and the maximum variation in v f . also, bear in mind that over-current protection (ocp) is triggered at 0.85 x ovp trigger voltage. if the ovp function operates, it will not release unless the dcdc voltage drops to 72.5% of the ovp trigger voltage. for example, if r ovp1 (output voltage side), r ovp2 (gnd side ), and dcdc voltage v out are conditions for ovp, then: ? ? v r r r v ovp ovp ovp out 0.2 / 2 2 1 ? ? ? ovp will operate when v out > 32 v if r ovp1 = 330 k and r ovp2 = 22 k . (3) buck-boost dc/dc converter oscillation frequency (f os c ) the regulators internal t riangular wave oscillation frequency can be set using a resistor connect ed to the rt pin (pin 26) . this resistor determines the charg e/ discharge current to the internal capacitor, thereby chan ging the oscillating frequency . refer to the following theoretical formula when setting rt: ? ? ? ? khz r 10 30 f rt 6 osc ? ? ? 30 x 10 6 (v/a/s) is a constant (16.6%) determined by the internal circuit ry , and is a correction factor that varies in relation to rt: {rt : = 0k: 0.98, 0k: 0.98, 70k: 0.99, 80k: 0.994, 90k: 0.99, 1 00k: 1.0, 1 0k : 1.01, 200k: 1.02, 300k: 1.03, 400k: 1.04, 00k: 1.04 } a resistor in the range of 2.k to 23k is recommended. se ttings that deviate from the frequency range shown below may cause switching to stop, and proper operation cannot be guaranteed. figure 13. switching frequency vs rt (4) external dc/dc converter oscillating frequency synchronization (f sync ) do not switch from external to internal oscillation of the dc/dc con verter if an external synchronization signal is present on the sync pin . when the signal on the sync terminal is switched from high to low, a delay of abou t 30 s (typ) occurs before the internal oscillation circuitry starts to operate (only the rising edge of the input clock sign al on the sync terminal is recognized). moreover, if external input frequ ency is less than the internal oscillation frequency, the internal oscillator will operate after the above-mentio ned 30 s (typ ) delay ; thus, do not input a synchronization signal with a frequency less than the internal oscillation freque ncy. 50k 150k 250k 350k 450k 550k 0 100 200 300 400 500 600 700 800 rt [k ] ? [khz] frequency [khz] rt [k] downloaded from: http:///
BD8119FM-M 12 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (5) soft start function the soft-start (ss) limits the current and slows the rise-time of th e output voltage during the start-up, hence it leads to prevention of the overshoot on the output voltage and the inrush current. (6) self-diagnostic functions the operating status of the built-in protection circuitry is propagated to fail1 and fail2 pins (open-drain outputs). fail1 becomes low when uvlo, tsd, ovp, or scp protection is engage d, whereas fail2 becomes low when open or short led is detected. (7) operation of the protection circuitry (a) under-voltage lock out (uvlo) the uvlo shuts down all the circuits other than vreg when v cc ? 4.3v (typ ). (b) thermal shut down (tsd) the tsd shuts down all the circuits other than vreg when the tj reaches 175c (typ), and releases when the tj becomes below 150c (typ). (c) over-current protection (ocp) the ocp detects the current through the power-fet by monitoring the voltage of the high-side resistor, and activates when the cs voltage becomes less than v cc -0.6v (typ ). when the ocp is activated, the external capacitor of the ss pin becomes discharged and the switching operation of the dcdc turns off . (d) over voltage protection (ovp) the output voltage of the dcdc is detected with the ovp-pin vol tage, and the protection activates when the ovp-pin voltage becomes greater than 2.0v (typ ). when the ovp is activated, the external capacitor of the ss pin beco mes discharged and the switching operation of the dcdc turns off. (8) short circuit protection (scp) when the led-pin voltage becomes less than 0.3v (typ), the i nternal counter starts operating and latches off the circuit approximately after 100ms (when f osc = 300khz). if the led-pin voltage becomes over 0.3v before 100ms , then the counter resets. when the led anode (i.e. dcdc output voltage) is shorted to g round, then the led current becomes off and the led-pin voltage becomes low. furthermore, the led current als o becomes off when the led cathode is shorted to ground. hence in summary, the scp works with both cases of the led anode and the cathode being shorted. (9) led open detection when the led-pin voltage ? 0.3v (typ) as well as ovp-pin voltage ? 1.7v (typ) simultaneously, the device detects as led open and latches off that particular channel. uvlo tsd ovp ocp s r q scp en=low uvlo/tsd fail1 en=low uvlo/tsd fail2 mask counter open short s r q downloaded from: http:///
BD8119FM-M 13 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (10) led short detection when the led-pin voltage ? 4.7v (typ ) and ovp-pin voltage ? 1.6v (typ) simultaneously, the internal counter starts oper ating and the only detected channel (as led short) latches off ap proximately after 100ms (when f osc = 300khz) . with the pwm brightness control, the detecting operation is p rocessed only when pwm-pin = high. if the condition of the detection operation is released before 100ms (when f osc = 300khz), then the internal counter resets. (note) the counter frequency is the dcdc switching frequency determined by the rt. the latch proceeds at the count of 32770. protection detecting condition operation after detect [detect] [release] uvlo v reg <4.3v v reg >4.5v all blocks shut down tsd tj>1 75 c tj<150c all blocks (except vreg) shut down ovp v ovp >2.0v v ovp <1.45v ss discharges ocp v cs v cc -0.6v v cs >v cc -0.6v ss discharges scp v led <0.3v (100ms delay when f osc =300khz) en or uvlo counter starts and then latches off all blocks (except vreg) led open v led <0.3v & v ovp >1.7v en or uvlo only the detected channel latches off led short v led >4.7v & v ovp <1.6v (100ms delay when f osc =300khz) en or uvlo only the detected channel latches off (after the counter sets) downloaded from: http:///
BD8119FM-M 14 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 4. protection sequence (note 1) turn on the en after the vcc is on (note 2) sync and pwm inputs are allowed to be on before the vcc is on (note 3) approximately 100ms of delay when f osc = 300khz (note 4) this waveform is pulled up by a external supply. case for led2 in open-mode when v led2 < 0.3v and v ovp > 1.7v simultaneously, then led2 becomes off and fail2 becomes low case for led3 in short-mode when v led3 > 4.7v and v ovp < 1.6v simultaneously, then led3 becomes off after 100ms approx case for led4 in short to gnd -1 dcdc output voltage increases, and then ss dichages and fail1 become s low -2 detects v led4 <0.3v and shuts down after approximately 100ms vcc en uvlo vdac sync pwm ss iled1 iled2 iled3 iled4 vled1 vled2 vled3 vled4 vovp fail1 fail2 4.5v 1.0 <0.3 >4.7 100 ms 3 0.3v 100 ms 3 2.0v 1.7v 1 2 2 1 4 vreg (note 1) (note 2) (note 2) (note 3) (note 4) (note 1) (note 3) downloaded from: http:///
BD8119FM-M 15 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 5. procedure for external components selection follow the steps as shown below for selecting the external comp onents (1) work out i l_max from the operating conditions. (2) select the value of r cs such that i ocp > i l_max (3) select the value of l such that 0.05v/s < v out / l < 0.3v/ s (4) select coil, schottky diodes, mosfet and r cs which meet with the ratings (5) select the output capacitor which meets with the ripple volt age requirements (6) select the input capacitor (7) work on the compensation circuit (8) work on the over-voltage protection (ovp) setting (9) work on the soft-start setting (10) verify experimentally feedback the value of l downloaded from: http:///
BD8119FM-M 16 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (1) computation of the input peak current and i l_max calculation of the maximum output voltage (v out_max ) to calculate the v out_max , it is necessary to take into account the v f variation and the number of led connect ed in series. ? ? v n v v v f f max out 0.1 _ ? ? ?? ? where: v f is the v f variation n is the number of led connection in series calculation of the output current i out m i i led out ? ? ? 05 .1 where: m is the number of led connections in parallel calculation of the input peak current i l_max ? ? ? ? in out out n i avg l l avg l max l v i v v i i i i ? ? ? ? ? ? ? ? / 21 _ _ _ out in out osc in l v v v f l v i ? ? ? ? ? 1 (a) the worst case scenario for v in is when it is at the minimum, and thus the minimum value should be applied in the equation. (b) an l value of 10 f to 47f is recommended. the current-mode type of dc/dc conversio n is adopted for BD8119FM-M, which is optimized with the use of the recommende d l value in the design stage. this recommendation is based upon the efficiency as well as t he stability. l values outside this recommended range ma y cause irregular switching waveform and hence deterioration of st able operation. (c) (efficiency) is approximately 80% external application circuit (2) the setting of over-current protection choose r cs with the use of the equation v ocp_min (=0.54v) / r cs > i l_max when investigating the margin, it is worth noting that the l value may vary by approximately 30%. v in r cs d 1 l d 2 m 2 m 1 c o ut v out i l cs where: is the efficiency f osc is the switching frequency downloaded from: http:///
BD8119FM-M 17 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (3) the selection of the l in order to achieve stable operation of the current-mode dc/dc converter, we recommend selecting the l value in the range indicated below: ? ? s v l r v s v cs out ? ? /3.0 ]/[ 05 .0 ? ? ? the smaller l r v cs out ? allows stability improvement but slows down the response time . (4) selection of coil l, diode d 1 and d 2 , mosfet m 1 and m 2 , and r cs current rating voltage rating heat loss coil l > i l_max D diode d 1 > i ocp > v in_max diode d 2 > i ocp > v out mosfet m 1 > i ocp > v in_max mosfet m 2 > i ocp > v out r cs D D > i ocp 2 x r cs (note 1) allow some margin such as the tolerance of the external compone nts when selecting. (note 2) in order to achieve fast switching, choose a mosfet with the small er gate-capacitance. (5) selection of the output capacitor select the output capacitor c out based on the requirement of the ripple voltage vpp. esr l osc in out out out out pp r i f v v v c i v ? ? ? ? ? ? S 1 choose c out that allows the vpp to settle within the requirement. allo w some margin also, such as the tolerance of the external components. (6) selection of the input capacitor a capacitor at the input is also required as the peak curr ent flows between the input and the output in dc/dc conversion. an input capacitor greater than 10f with the esr sm aller than 100m is recommended . an input capacitor outside the recommended range may cause large ri pple voltage at the input and may lead to malfunction. downloaded from: http:///
BD8119FM-M 18 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (7) phase compensation guidelines in general, the ne gative feedback loop is stable when the following conditio ns are met: overall gain of 1 (0db) with a phase lag of less than 150 o (i.e., a phase margin of 30o or more) however, as the dc/dc converter constantly samples the switching frequency, the gain- ba ndwidth (gbw) product of the entire series should be set to 1/10 the switching freq uency of the system. therefore, the overall stability characteristics of the application are as follows: (a) overall gain of 1 (0db) with a phase lag of less than 150 o (i.e., a phase margin of 30o or more) (b) gbw (frequency at gain 0db) of 1/10 the switching frequency thus, to improve response with in the gbw product limits, the switching frequency must be increased. the key for achieving stability is to place fz near to the gbw. the gbw depends on a phase lag "fp1" that is decided by c out and output impedance rl. the phase-lead and the phase-lag are the following. phase-lead ? ? hz cpcrpc fz ? 2 1 ? phase-lag ? ? hz rlc fp out ? 2 1 1 ? good stability would be obtained when the fz is set between 1k hz to 10khz. in buck-boost applications, right-hand-plane (rhp) zero exists. this zero has no gain but a pole characteristic in terms of phase. as this zero may cause instability when it is in the control loop, it is necessary to bring this zero before the gbw. ? ? ? ? hz l i v v v v f load in out in out rhp ? 2 / ? ? ? where: i load is the maximum load current it is important to keep in mind that these are not very stri ct guidelines. adjustments may have to be made to ensu re stability in the actual circuitry. it is also important to note that stability characteristics can change greatly depend ing on factors such as substrate layout and load conditions. the refore, when designing for mass-production, stability shou ld be thoroughly investigated and confirmed in the actual physica l design. (8) setting of the over-voltage protection we recommend setting the over-voltage protection v ovp from 1. 2v to 1.5v greater than v out which is adjusted by the number of leds in series connection. less than 1.2v may cause unexpected detection of the led open and short during the pwm brightness control. for v ovp greater than 1.5v, the led short detection may become invalid. fb a comp v out rpc led cpc 2.0v/1.45v 1.7v/1.6v ovp v out r ovp2 r ovp1 downloaded from: http:///
BD8119FM-M 19 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 (9) setting of the soft-start the soft-start allows minimizing the coil current as well as t he overshoot of the output voltage at start- up. for the capacitance, the range of 0.001f to 0.1f is recommended . capacitance less than 0.001f may cause overshoot on the output voltage. capacitance greater than 0.1f may cause massive reverse current through the parasitic elements of the ic that can damage the whole device . in case it is necessary to use the capacitance greater than 0.1f, provide a reverse current protection diode at the v cc or a bypass diode placed between the ss-pin and the v cc . soft-start time t ss ? ? s 0.7v/5a c t ss ss ? ? where: c ss is the capacitance at the ss- pin (10) verification of the operation by taking measurements the overall characteristic may change by load current, in put voltage, output voltage, inductance, load capacitanc e, switching frequency, and the pcb layout. we strongly recommend verifying your design by taking the actual measurements. power dissipation po wer dissipation can be calculated as follows: ? ? ? ? ? ? led f led cc sw reg iss cc cc i 1 n v n v v f v c 2 v i n pc ? ? ? ? ? ? ? ? ? ? ? ? ? where: i cc is the maximum circuit current v cc is the supply power voltage c iss is the external fet capacitance v sw is the sw gate voltage f sw is the se frequency v led is the led control voltage n is the led parallel numeral v f is the led v f fluctuation i led is the led output current sample calculation: ? ? ? ? 100ma 3 v 4 1.0v 30v 300khz 5v 500pf 30v 10ma 4 pc f ? ? ?? ? ? ? ? ? ? ? ? ? 1622.5mw 1.3w 322.5mw 4 pc 3.0v, v f ? ? ? ? figure 14 (note 1) power dissipation calculated when mounted on 70mm x 70mm x 1.6 mm glass epoxy substrate (1 -layer platform/copper thickness 18m) (note 2) power dissipation changes with the copper foil density of the board. the area of the copper foil becomes the total area of the heat radiatio n fin and the foot pattern (connected directly with ic) of this ic. this value represents only observed values, not guaranteed values . pd=2200mw ( 968mw): substrate copper foil density 3% pd=3200mw (1408mw): substrate copper foil density 34% pd=3500mw (1540mw): substrate copper foil density 60% (value withi n parentheses represents power dissipation when ta=95c) (note 3) please preserve that the ambient temperature + self-gener ation of heat becomes 150 c or less because this ic has a tj=150 c . (note 4) please note the heat specification because there is a possibility t hat thermal resistance rises from the examination result of the temperature cycle by 20% or less. pd [mw] 0 500 1000 1500 2000 2500 0 0.5 1 1.5 2 2.5 3 3.5 l?Svf[v] iled= 50ma iled= 100ma iled= 150ma power dissipation led fluctuation : v f [v] ambient temperature ta[ ] 4 power dissipation pd[ ] 2 1 0 150 125 100 75 50 25 3 (3) 3.50w (2) 3.20w (1) 2.20w (1) ja=56.8 /w (substrate copper foil density 3%) (2) ja=39.1 /w (substrate copper foil density34%) (3) ja=35.7 /w (substrate copper foil density60%) 95 ambient temperature : ta [c] power dissipation : pd [w] i led = 50 ma i led = 100ma i led = 15 0ma power dissipation : pd [w] downloaded from: http:///
BD8119FM-M 20 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 1. the coupling capacitors c vcc and c reg should be mounted as close as possible to the ics pin s. 2. large currents may pass through dgnd and pgnd, so each should ha ve its own low-impedance routing to the system ground. 3. noise should be minimized as much as possible on pins vdac, iset, rt and comp. 4. pwm, sync and led1-4 carry switching signals, so ensure durin g layout that surrounding traces are not affected by crosstalk. 1. comp 2. ss 3. vcc 4. en 5. rt 6. sync 7. gnd fin. fin 8. pwm 9. fail1 10. fail2 11. leden1 12. leden2 13. led1 14. led2 28. vreg 27. boot 26. cs 25. outh 24. sw 23. dgnd 22. outl fin. fin 21. fbr 20. pgnd 19. iset 18. vdac 17. ovp 16. led4 15. led3 vcc vcc c in1 c in2 c pc2 c pc1 r pc1 c ss en sw1 c rt r rt sync c in3 pwm r fl1 r fl2 vreg fail1 fail2 vreg sw2 sw3 led1 led2 led4 led3 vdac r dac vreg c iset r iset d 1 l 1 d g m 2 s c out1 c out2 d 2 r ovp1 r ovp2 c bt c reg m 1 s d g r cs5 vreg out c cs r cs1 r cs2 r cs3 downloaded from: http:///
BD8119FM-M 21 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 application board part list serial no. component name component value product name manufacturer 1 cin1 10f grm31cb31e106ka75b murata 2 cin2 3 cin3 4 cpc1 0.1f 5 cpc2 murata 6 rpc1 510 7 css 0.1f grm188b31h104ka92 murata 8 rrt 100k mcr03 series rohm 9 crt 10 rfl1 100k mcr03 series rohm 11 rfl2 100k mcr03 series rohm 12 ccs 13 rcs1 620m mcr100jzhflr 62 0 ro hm 14 rcs2 620 m mcr100jzhflr620 rohm 15 rcs3 16 rcs5 0 17 creg 2.2f grm188b31a225ke33 murata 18 cbt 0.1f grm188b31h104ka92 murata 19 m1 rss070n05 rohm 20 m2 rss070n05 rohm 21 d1 rb050l- 40 rohm 22 d2 rf201l2s rohm 23 l1 33h cdrh 105r330 sumida 24 cout1 10f grm31cb31e106ka75b murata 25 cout2 10f grm31cb31e106ka75b murata 26 rovp1 30k mcr03 series rohm 27 rovp2 36 0k mcr03 series rohm 28 riset 120k mcr03 series rohm 29 ciset 30 rdac 0 1. the above values are fixed numbers for confirmed operat ion with the following conditions: v cc = 12v, four parallel channels of five series-connected leds, and i led =50ma. 2. optimal values of external components depend on the ac tual application; these values should only be used as guid elines and should be adjusted to fit the operating conditions of the actual application. when performing open/short tests of the external components , the open condition of d 1 or d 2 may cause permanent damage to the driver and/or the external components. in orde r to prevent this, we recommend having parallel connectio ns for d 1 and d 2 . downloaded from: http:///
BD8119FM-M 22 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 i/o equivalent circuits (terminal name follows pin number) 1. comp 2. ss 4. en 5. rt 6. sync, 8. pwm 9. fail1, 10. fail2 11. leden1, 12. leden2 13. led1, 14. led2, 15. led3, 16. led4 17. ovp 18. vdac 19. iset 22. outl 24. sw 25. outh 26. cs 27. boot 28. vreg 21. cs 5k v cc n.c. n.c. = no connection (open) 1k ss v cc vreg 10k 3.3v 150k sync pwm 1k fail1 fail2 500 vdac v cc vreg 500 iset v cc 12.5 vreg vreg 100k outl vreg vreg boot sw vreg v cc vreg 205k 100k 10k 3.3v 150k leden1 leden2 10k comp 2k 2k vreg vreg en 175k 135k 10k v cc sw v cc boot 100k outh boot sw sw sw 5k ovp 10k v cc rt vreg 167 v cc 2.5k 5k led1 to l ed 4 downloaded from: http:///
BD8119FM-M 23 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all pow er supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, th e two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedanc e. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the pd stated in this specification is whe n the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy b oard. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and del ays, especially if the ic has more than one power supply. therefore, give special consideration to power c oupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as met al particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
BD8119FM-M 24 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 operational notes C continued 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasi tic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 15. example of monolithic ic structure 13. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. tsd on temperature [c] (typ) hysteresis temperature [c] (typ) 175 25 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
BD8119FM-M 25 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 ordering information b d 8 1 1 9 f m - m e 2 part number package fm: hsop-m28 packaging and forming specification e2: embossed tape and reel marking diagram part number marking package part number bd8119fm hsop-m28 reel of 1500 bd8119fm C me2 hsop-m28 (top view) b d 8 11 9 f m part number marking lot number 1pin mark downloaded from: http:///
BD8119FM-M 26 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 physical dimension, tape and reel information package name hsop-m28 max 18.85 (include. burr) unit mm pkg hsop-m28 drawing: ex141- 5001 downloaded from: http:///
BD8119FM-M 27 / 27 tsz02201-0t3t0c600030-1-2 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 28.aug.2014 rev.001 revision history date revision changes 28.aug.2014 001 new release downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class | class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohms products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet datasheet notice C ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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